Empowering product engineering by building an AI-Powered solution for hardware products

Datics AI is the best! We worked with them for a very long time - and they always surprised us with their work on the project and were always a step ahead of what we asked for.
Moran Bitton
Founder, Ideeza

Hardware engineering

Project duration


Team members

  • 4 AI engineers
  • 2 NLP engineers
  • 2 mobile app developers
  • 2 electrical engineers
  • 1 project manager


NLP technologies and algorithms [Reinforcement Learning algorithms and Genetic Algorithms]

Service Used

Team Augmentation

How Ideeza Works?

Their Need

Traditional constraints posed significant challenges to this audacious goal. IDEEZA recognized that in order to secure initial funding, they needed to craft a Minimum Viable Product (MVP). The MVP must be able to translate their vision of building hardware products through AI engineering. The initial products included:

  • House surveillance
  • Healthcare
  • Mobile Applications
  • Farming tools

This demanded an expert team, ranging from AI and NLP to backend development and mobile app creation. However, internal team limitations led to external support to translate their vision into tangible results.

The heart of this module was its dialogue generation component, which responded dynamically to user queries, enhancing user interaction.

Ideeza, NLP Module
Our Expert Solutions

Datics AI stepped in as IDEEZA's strategic partner, deploying a skilled team to address every facet of their aspiring project. Our collaboration brought together specialists in AI engineering, NLP, project management, mobile app development, and electrical engineering, forming a cohesive unit dedicated to the backend development of IDEEZA's platform.

Our engagement followed an eight-module strategy, meticulously designed to conquer IDEEZA's challenges and bring their vision to reality.

NLP Module: Speech/text query to electronic entities and automated bot

The NLP module formed the bedrock of the project. It took speech/text queries, normalized them, and employed entity extraction to identify electronic components. Additionally, it parsed parameters like voltage and current needs from queries, structuring them into code blocks. The heart of this module was its dialogue generation component, which responded dynamically to user queries, enhancing user interaction.


This module evolved through two phases.


In Phase 1, we tackled data augmentation and trained the system with domain-specific data. Chatito, a new tool, was leveraged to generate examples for diverse electronic components. Data preprocessing and processing techniques, including the application of “RASA,” honed the system’s ability to extract electronic component entities.


In Phase 2, we integrated RASA-Core for dialogue generation. This component utilized NLP results to formulate meaningful responses, enriching user interactions.

Combination Modules

The Combination Module seamlessly amalgamated electronic components into stable circuits, optimized voltage, current, and input requirements. Prioritizing needs, we created cost-effective, stable combinations that met critical specifications.

Placement Modules

The Placement Module, fueled by AI, employed Learning Classifier System with Reinforcement Learning. It ensured optimal component placement on PCBs, adhering to design constraints for efficient electronic connections.

Routing Module

The Routing Module revolutionized circuit connectivity for IDEEZA. Powered by AI-driven A* algorithms, it swiftly designed optimized paths, and ensured efficient connections between components. This automation minimized interference, enhanced overall performance, and expedited prototype creation.

Bin Packing Module

Addressing spatial constraints, the Bin Packing Module employed advanced algorithms to strategically position multiple PCBs and batteries. This optimization process allowed IDEEZA to design integrated hardware solutions that made the most of available space without compromising functionality.

3D Routing

Navigating the complexities of three-dimensional space, the 3D Routing Module excelled. By leveraging customized A* algorithms, it formulated efficient pathways for component connections. This translated IDEEZA’s hardware designs into functional reality, ensuring components were seamlessly interconnected within the three-dimensional realm.

Generative Design Module

The Generative Design Module reimagined circuit aesthetics. Manual covers limited to specific instances prompted the need for adaptable designs. This module crafted real-time covers based on user preferences, offered a fresh dimension of creativity. The ongoing research aimed to refine this approach, ultimately delivering covers with precise dimensions and data tailored to individual hardware configurations.

Gerber/Firmware Module

Transitioning from design to reality, the Gerber/Firmware Module was key. It streamlined the optimal placement, routing, and drilling data into Gerber files. These files contained machine commands from Python arrays, serving as manufacturing blueprints. Organized by timestamps in dedicated directories, they ensured efficient production.

Android App Module

The Android App Module transformed user interactions. It automated user-specific APKs, connected hardware and smartphones seamlessly. Whether drones or video doorbells, this module simplified complex functions via interconnected blocks and ensured intuitive control.



Efficient NLP and AI-Driven Communication:

Our sophisticated NLP module, powered by AI algorithms, enabled seamless interaction between users and hardware components. This breakthrough facilitated accurate speech-to-text conversion, precise entity extraction, and intuitive dialogue generation. As a result, IDEEZA’s hardware design process became smoother and more user-friendly.


Streamlined Manufacturing Processes:

The Gerber/Firmware Module streamlined manufacturing by compiling complex placement, routing, and drilling data into easily interpretable Gerber files. These files provided manufacturers with precise instructions, minimizing errors and expediting production. Additionally, the Android App Module automated user-specific APK creation, simplifying control and enhancing the user experience.


Revolutionized Hardware Cover Design:

The Generative Design Module transformed hardware cover design. This module allowed real-time customization of covers based on user preferences, enhancing both aesthetics and functionality. The ongoing research in this area promises to deliver covers with precise dimensions and data, tailored to individual hardware configurations.


Cohesive System Integration:

Leveraging Kotlin programming, we ensured the cohesive integration of modules, creating adaptable and user-centric hardware solutions. This strategic choice underpinned the seamless functionality of IDEEZA’s innovative modules, bridging the gap between hardware potential and real-world impact.

What sets us Apart

With our Team Augmentation service, we collaborated with IDEEZA and built a custom solution according to their roadmap to develop an MVP. We quickly put together a team of senior engineers, including the Project manager, AI and NLP engineers, technical lead, mobile application developers, and other expert engineers. We also scaled the team as per the client’s requirements, accelerating the MVP development process. Our teams are 100% bilingual, go through a strict selection process, and always work in the overlapping time zone as our clients to guarantee real-time collaboration and superior feedback times.

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